Lapping plate is abrasive plates that grind semiconductor wafers. Through the lapping process, the workpieces precisely processed by a milling machine or a grinder are further smoothened for the final surface treatment by spraying lapping materials on the plate.

JUWON PMS first started domestic production of lapping plate after acquiring know-how from EBARA that is a manufacturer of lapping plate in Japan. It is the first Korean company to sign a supply contract with Naoetsu Electronics of Japan Shinetsu Group, a world's leading manufacturer of semiconductor.
Based on the lapping plate manufacturing technology, JUWON PMS is planning to sign supply contracts with leading semiconductor manufacturers in and out of Korea.